Silver Plating Services per Federal Specification QQ-S-365D

silver electrolytic plating Thank you for visiting the Advanced Plating Technologies Specification Database. Below is a technical summary of specification QQ-S-365D from Federal Specification for Silver. For more information on our full line of Silver services please visit our silver plating services page. You can also request a quote or contact a member of our technical sales team for more information.

Revision: 31201
Finish: Silver
Company: Federal Specification
Application: Silver deposits are defined as follows: Type I (Matte), Type II (Semi-bright), Type III (Bright), Grade A (with supplementary tarnish-resistant treatment), Grade B (without supplementary tarnish-resistant treatment)
Appearance: Varies by Type
Plate Thickness: per 3.4.1 – Unless otherwise specified the minimum plating thickness shall be 0.0005″ on all surfaces on which silver is functionally necessary (for example: appearance, wear, corrosion protection, conductivity). The plating on non functional surfaces and areas shall be of sufficient thickness to ensure plating continuity and uniform utility, appearance, and protection. On ferrous surfaces the total plated thickness shall be not less than 0.0010″. This must be comprised of at least 0.0005″ or more of silver plate over 0.0005″ or less of nickel or copper or any combination thickness of nickel and copper from 0-100%. The copper shall be deposited first over the steel surface.
Strike Thickness: per 3.3.5 – The final silver deposit shall be preceded by an electrodeposited coating of silver from silver strike solutions. Then plating shall be applied over an intermediate coating of nickel or nickel over copper on steel, zinc and zinc-base alloys. Copper and copper base alloys require intermediate coatings. Copper-alloy basis metal articles on which a nickel undercoat is not used and other basis metal whereon a copper undercoat is employed shall not be used for continuous service at a temperature in excess of 300F. Adhesion of the silver plating is adversely affected because of the formation by diffusion of a weak eutectic of silver and copper at the silver-copper interface.
Notes: QQ-S-365 makes no distinction of purity in the specification. Only the appearance of the deposit is addressed in the Type callout.

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