Copper Plating Services per Military Specification (Mil Spec) MIL-C-14550

Thank you for visiting the Advanced Plating Technologies Specifi cation Database. Below is a technical summary of specification MIL-C-14550 from Military Specification (Mil Spec) for Copper. For more information on our full line of Copper services please visit our nickel plating services or our electroless nickel plating page. You can also request a quote or contact a member of our technical sales team for more information.

Revision: B
Finish: Copper
Company: Military Specification (Mil Spec)
Application: Plating (electrodeposited) copper on metal surfaces.
Appearance: Copper plating shall be smooth, fine grained, & adherent. Shall not have blisters, pits, scale, nodules or other defects.
Plate Thickness: Class 0 – 0.001-0.005 inches minimum deposit thickness Class 1 – 0.001 inch minimum deposit thickness Class 2 – 0.0005 inch minimum deposit thickness Class 3 – 0.0002 inch minimum deposit thickness Class 4 – 0.0001 inch minimum deposit thickness
Strike Thickness: Not Specified
Notes: Hydrogen Embrittlement: All steel parts with HRC > 44 shall be baked at 375+/-25F for 24 Hrs w/in 4 Hrs.

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