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Revision: 1997
Finish: Copper
Company: ASTM
Application: Plating (electrodeposited) copper on metal surfaces for engineering purposes. (surface hardening, heat treatment stop-off, electromagnetic interferences, shielding for circuitry, joining, etc)
Appearance: Copper plating shall be smooth, continuous, uniform, & adherent. Shall not have blisters, cracks, pits, pin-holes, flaking, nodules or other defects.
Plate Thickness: Class 25 – 25um minimum coating thickness Class 20 – 20um minimum coating thickness Class 12 – 12um minimum coating thickness Class 5 – 5um minimum coating thickness Class x – Thickness as specified [um]
Strike Thickness: Not Specified
Notes: Hydrogen Embrittlement: Steel parts with hardness > 31 HRC shall require hydrogen embrittlement relief when specified.
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