Thank you for visiting the Advanced Plating Technologies Specification Database. Below is a technical summary of specification ASTM B488-11 from ASTM for Gold. For more information on our full line of Gold services please visit our gold plating services page. You can also request a quote or contact a member of our technical sales team for more information.
Application: Gold deposits are defined as follows: Type I (99.70% Pure), Type II (99.00% Pure), Type III (99.90% Pure); Code A (90 Hk25 Max), Code B (91-129 Hk25), Code C (130-200 Hk25) or Code D (> 200 Hk25); Class defines minimum thickness in microns (e.g. Class 1.0 is 1.0um minimum gold thickness)
Plate Thickness: Class defines minimum thickness in microns (e.g. Class 1.0 is 1.0um minimum gold thickness)
Strike Thickness: 6.5.1 Nickel Underplating: For thickness classes except 5.0, a nickel underplating shall be applied before the gold coating when the product is made from copper or copper alloy.
Notes: The 2001 version of ASTM B488 aligned the purity type callouts to match Mil-G-45204. Prior to the 2001 version the Type callout of the ASTM did not match the Mil-Spec.Back to Spec Database
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