Thank you for visiting the Advanced Plating Technologies Specification Database. Below is a technical summary of specification 4-03453-0140 from TE Connectivity for Gold. For more information on our full line of Gold services please visit our gold plating services page. You can also request a quote or contact a member of our technical sales team for more information.
Company: TE Connectivity
Application: Gold per MIL-G-45204, Type I, Grade C
Plate Thickness: 0.000005-0.000025″ Average
Strike Thickness: Electroclean in alkaline cleaner, cold rinse, fluoboric acid dip, cold rinse, hydrochloric acid dip, cold rinse, cold rinse, sulfuric acid dip, cold rinse, cold rinse, do not copper strike
Notes:Back to Spec Database
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