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Revision: K
Finish: Copper
Company: AMS (SAE)
Application: Plating (electrodeposited) copper on metal surfaces to provide an anti-seizing surface or brazing surface, prevent carburizing/decarburizing, enhance solderability, etc.
Appearance: Copper plating shall be smooth, continuous, uniform, & adherent. Shall not have blisters, pits, pin-holes, nodules or other defects.
Plate Thickness: Type 1 (Engineering Plating) Shall designate a thickness of 0.0005″ to 0.0007″ Type 2 (Plating for Masking) shall be nominally 0.002″ with no area having a plate thickness of less than 0.0007″
Strike Thickness: Copper shall be plated directly onto the substrate. Nickel flash is acceptable for parts made from corrosion-resistant/heat-resistant steels or similar alloys.
Notes: Hydrogen Embrittlement: For steel parts per AMS 2759/9
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