Revision: A 13Feb73
Finish: Tin/Lead
Company: Military Specification (Mil Spec)
Application: 50 to 70% Tin by weight, 1% other metals, balance lead. (60/40 nominal composition)
Appearance: Matte or bright are acceptable, matte only for electronic components
Plate Thickness: 0.0003″ Min unless otherwise specified
Strike Thickness: No underplate unless otherwise specified. Copper alloys > 15% Zn get copper or nickel 0.0001″ Min
Notes: >40 HRC HE Relief bake called out
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